3-S-Isothiuronium propyl sulfonate CAS 21668-81-5

Description

3-S-Isothiuronium propyl sulfonate, CAS 21668-81-5, often referred to by the abbreviation UPS, is a specialized organosulfur compound. It typically presents as a white to almost white crystalline powder. This chemical is primarily utilized as an additive in the electroplating industry, where it plays a crucial role in modifying the properties of deposited metal layers.

Properties

Property	Value
CAS Number	21668-81-5
Chemical Name	3-S-Isothiuronium propyl sulfonate
Common Abbreviation	UPS
Alternate Names	3-(Amidinothio)-1-propanesulfonic acid, Isothioureidopropylsulfonic acid
Molecular Formula	C4​H10​N2​O3​S2​
Molecular Weight	Approximately $198.26\text{ g/mol}$
Appearance	White to almost white crystalline powder
Melting Point	Approximately $240\text{ °C}$ (may vary, some sources indicate up to $256\text{ °C}$)
Solubility	Soluble in water (e.g., $25\text{ mg/mL}$, forming a clear, colorless solution)
Storage Temperature	Room temperature, keep in a dark, cool, dry place, inert atmosphere recommended

Usage

3-S-Isothiuronium propyl sulfonate (UPS) is predominantly used in the electroplating industry with the following key applications:

• Electroplating Additive (Brightener): UPS serves as a highly effective brightener in acid copper plating baths. When used in conjunction with other additives like polyethylene glycols and non-ionic surfactants, it facilitates the deposition of bright, level, and ductile copper coatings. This is essential for achieving desired aesthetic and functional properties in various applications, including electronics and decorative finishes. For example, it helps in producing smooth and shiny copper layers on printed circuit boards.
• Other Metal Plating: Beyond copper, UPS can also be employed in other acidic electroplating processes, such as those for silver and palladium deposition, to enhance the quality of the plated layers.
• Electroless Plating: In some formulations, it may act as an activation accelerator, helping to shorten the incubation time required for electroless plating processes.

While the primary commercial use is in electroplating, it has also been noted in proteomics research as a component in standard sets for analytical techniques like mass spectrometry.

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