Product Description
Polyethylene,Propyleneglycol (beta-Naphthyl) (3-Sulfopropyl) Diether, Potassium Salt is a high-performance polymer used as a crucial additive in the electroplating industry. It is specifically designed as a suppressor and leveling agent in acid copper plating baths. Its unique molecular structure allows it to adsorb onto the cathode surface, modifying the deposition process to produce exceptionally smooth, bright, and ductile copper layers. It is particularly effective in plating complex geometries, such as those found in printed circuit boards (PCBs), by ensuring uniform coating thickness and preventing high-current-density burning.
Product Properties
Property Value CAS Number 120478-49-1 Common Abbreviation PN-BEST Chemical Formula C₂₇H₃₄KNO₉S Molar Mass 591.72 g/mol Appearance Yellowish to brownish liquid Solubility Soluble in water Purity Typically supplied as an aqueous solution Synonyms Poly(oxy-1,2-ethanediyl), .alpha.-[2-[bis(2-hydroxyethyl)amino]propyl]-.omega.-(2-naphthyloxy)-, 3-sulfo deriv., potassium salt Product Usage
This specialty chemical is primarily used in electrochemical applications:
- Acid Copper Electroplating: It is a key component in modern acid copper plating formulations, especially for the manufacturing of printed circuit boards (PCBs) and in decorative plating.
- Leveling Agent: It provides excellent leveling properties, filling in microscopic valleys on the substrate surface to create a mirror-bright finish.
- Suppressor/Carrier: Acts as a suppressor agent that improves the throwing power of the plating bath, ensuring uniform copper distribution even on complex parts with low-current-density areas.
- Functional Plating: Used in applications where ductile, void-free copper deposits are essential for performance and reliability.
Package:
25kgs/drum
Storage:
Store in a dry and ventilated warehouse.
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